22
MAX19794
10MHz to 500MHz Dual Analog Voltage Variable
Attenuator with On-Chip 10-Bit SPI-Controlled DAC
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance. For
best performance, route the ground-pin traces directly
to the exposed pad underneath the package. This pad
must be connected to the ground plane of the board by
using multiple vias under the device to provide the best
RF and thermal conduction path. Solder the exposed
pad on the bottom of the device package to a PCB.
RF Ground Return Capacitors
The device requires RF ground return capacitors C10
and C11. The value of these capacitors optimize the
dynamic range and frequency flatness for the RF band of
interest. Some recommended values are shown in Table 
7  along  with  the  resulting  performance  in  the  Typical
Operating Characteristics section.
Figure 2. SPI Timing Diagram
Figure 3. UP DWN Control Diagram (Mode = 1)
SPI Interface Programming
Table 7. Typical Application Circuit Component Values
*Add 2 additional 10I resistors between the V
CC
 pins leading to C5 and C6 unless a V
CC
 power plane is used.
DESIGNATION
QTY
DESCRIPTION
C1, C2, C4
3
0.01FF Q5% 50V X7R ceramic capacitors (0402).
C3
0
Not installed for two attenuators in cascade
C5C9
5
1000pF Q5% 50V COG ceramic capacitors (0402)
C10, C11
2
10MHz to 200MHz
0.01FF Q10% 50V X7R ceramic capacitors
(0402)
250MHz to 500MHz
100pF Q5% 50V COG ceramic capacitors
(0402)
C12
1
120pF Q5% 50V COG CER CAP (0402).Provides some external noise filtering along with R3.
C13
0
Not installed. A 4.7pF capacitor could be used to reduce any potential rise time glitching when
the comparator changes state.
R1*, R2*
2
10I Q5% resistor (0402)
R3
1
200I Q5% resistor (0402). This resistor is used to provide some lowpass noise filtering when
used with C12. The value of R3 slows down the response time. R3 also provides protection for
the device in case V
CTRL
is applied without V
CC
 present.
U1
1
MAX19794
R/W   A1   A0
D9, D8...D0 TO REGISTER 0, 1, 2, 3
CS
CLK
D
IN
D9, D8...D0 FROM REGISTER 0, 1, 2, 3
D
OUT
t
CS
HIGH-Z
HIGH-Z
t
CW
t
ES
t
EW
t
CH
t
EWS
UP
1
1
0
0
DWN
NO DAC
CODE CHANGE
DAC CODE
INCREASED
BY STEP UP
DAC CODE
DECREASED
BY STEP DOWN
DAC CODE
RESET TO
ALL 0's
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相关代理商/技术参数
MAX19794ETX+T 功能描述:衰减器 -IC 10MHz to 500MHz Attenuator RoHS:否 制造商:Skyworks Solutions, Inc. 最大衰减:18 dB 容差: 阻抗: 功率额定值:30 dBm 安装风格:SMD/SMT 工作温度范围:- 40 C to + 85 C
MAX1979ETM 功能描述:电压模式 PWM 控制器 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX1979ETM+ 功能描述:电压模式 PWM 控制器 Integrated Temp Ctlr for Peltier Modules RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX1979ETM+T 功能描述:电压模式 PWM 控制器 Integrated Temp Ctlr for Peltier Modules RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX1979ETM-T 功能描述:电压模式 PWM 控制器 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX197ACAI 功能描述:模数转换器 - ADC Integrated Circuits (ICs) RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
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